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TLWK1100B(T11)
TOSHIBA LED Lamp
TLWK1100B(T11)
Panel Circuit Indicator
* * * * * * * * Surface-mount devices 3.2 (L) x 2.9 (W) x 1.9 (H) mm LED chip + phosphor Luminous intensity : Iv = 1500 mcd (typ.) @20mA Color: White Topr / Tstg = -40 to 100C Applications: automotive use, backlighting etc. Standard embossed tape packing: T11 (2000/reel) 8-mm tape reel Unit: mm
Color and Material
Product Name TLWK1100B Color White Material InGaN
JEDEC JEITA TOSHIBA

Absolute Maximum Ratings (Ta = 25C)
Characteristics Forward Current Power Dissipation Operating Temperature Storage Temperature (Note 1) Symbol IF PD Topr Tstg Rating 30 114 -40~100 -40~100 Unit mA mW C C
Weight: 0.035 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Forward current derating
IF - Ta (mA) IF Allowable forward current
25 20 15 10 5 0 0 35 30
20
40
60
80
100
120
Ambient temperature
Ta
(C)
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Electrical Characteristics (Ta = 25C)
Characteristics Forward Voltage Reverse Voltage Symbol VF VR Test condition IF = 20 mA IR = 10 mA Min. 2.6 Typ. 3.2 0.75 Max. 3.8 Unit V V
Optical Characteristics (Ta = 25C)
Characteristics Chromaticity Luminous Intensity (Note 3) Symbol Cx Cy IV Test condition IF = 20 mA IF = 20 mA IF = 20 mA 1000 Min. Typ. (Note 2) (Note 2) 1500 2000 Max. Unit mcd
Note 2: The product is tested at the following chromaticity coordinate groups. Test conditions: IF=20mA, Ta=25C Accuracy: +/-0.01
0.4
A0 Cx Cy Cx Cy
B6
0.280 0.248 0.296 0.276 0.311 0.294
0.296 0.276 B5 0.311 0.294 B6 0.330 0.318
0.283 0.305 0.307 0.315 0.330 0.339
0.264 0.267 0.287 0.295 0.307 0.315
0.35
0.3
A0
B5
Cx Cy
Cy
0.25
0.2 0.2 0.25 0.3 Cx
Note 3: Iv rank classification Test conditions: IF=20mA, Ta=25C
Product name TLWK1100B(T11) WA1 WA2 Unit Luminous intensity IV min 1000 1000 1250 typ 1500 mcd max 2000 1600 2000 mA 20 IF
0.35
0.4
The specification on the above table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
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The cautions
* The product is sensitive to electrostatic and care must be fully taken when handling products. Particularly in the case that an over-voltage shall be applied, the overflowed energy may cause damage to or possibly result in destruction of the product. Buyer shall take absolutely secure countermeasures against electrostatic and surge when handling the product. The product is designed as a general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex. Light source for sensor, optical communication and etc) except general display light source.
*
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TLWK1100B
IF - V F
100 Ta = 25C
(typ.)
IV/IV(20 mA) - IF
3
(typ.)
Ta = 25C
(mA)
1 30
IF
IV/IV(20 mA)
2.8 3.0 3.2 3.4 3.6 3.8
0.3
Forward Current
10
0.1
3 0.03
1 2.6
0.01 1
3
5
10
30
50
100
300 500
Forward Voltage
VF
(V)
Forward Current
IF
(mA)
Relative IV - Tc
1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -20
(typ.)
0.32
Cx, Cy - IF
(typ.)
Ta = 25C
Relative luminous Intensity IV
0.31
Chromaticity Cx, Cy
0.3
Cx, Cy
0.29
0.28
0
20
40
60
80
100
0.27 0
10
20
30
40
50
Case Temperature
Tc
(C)
Forward current
IF
(mA)
Radiation pattern Ta = 25C (typ.) Relative luminous Intensity
1.0
Wavelength characteristic
(typ.)
0.8
20 30 40 50 60 70 80 90
10
0
10
20 30 40 50 60 70 80 90 1.0
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
0 300
400
500
600
700
800
Wavelength
(nm)
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TLWK1100B(T11)
Packaging
This LED device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the device may be affected by exposure to moisture in the air before soldering and the device should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopened within 12 months at the following conditions. Temperature: 5C~30C Humidity: 90% (max) 2. After opening the moisture proof bag, the device should be assembled within 168 hours in an environment of 5C to 30C/60% RH or below. 3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the device should be baked in taping with reel. After baking, use the baked device within 72 hours, but perform baking only once. Baking conditions: 605C, for 24 to 48 hours. Expiration date: 12 months from sealing date, which is imprinted on the label affixed. 4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices.
Mounting Method
Soldering
* Reflow soldering (example)
Temperature profile for Pb soldering (example) 10 s max (*) 240C max Package surface temperature (C) Temperature profile for Pb-free soldering (example) 5 s max(*) 260C max Package surface temperature (C)
(*)
(*)
140~160C max(*) 4C/s max
(*)
4C/s max(*) max(*) 150~180C 230C
4C/s max(*) 60~120 s max(*) Time (s)
(*) 4C/s max
max(*) 60~120 s Time 30~50s max(*) (s)
*
* *
*
The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions. Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30C, 60% RH (max) Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300C or less Time : within 3 s Do not perform wave soldering.
*
Recommended soldering pattern
1.65 1.15 1.65 2.41
Unit: mm
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Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES KAO CLEAN TROUGH 750H PINE ALPHA ST-100S TOSHIBA TECHNOCARE (FRW-17, FRW-1, FRV-100) : (made by ASAHI GLASS) : (made by KAO) : (made by ARAKAWA CHEMICAL) : (made by GE TOSHIBA SILICONES)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material. When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T11 (4-mm pitch) (2) Example
TLWK1100B (T11) Tape type Toshiba product No.
2.
Tape dimensions
Symbol D E P0 t F D1 Dimension 1.5 1.75 4.0 0.3 3.5 1.5 Tolerance +0.1/-0 0.1 0.1 0.05 0.05 0.1 Symbol P2 W P A0 B0 K0 Dimension 2.0 8.0 4.0 2.9 3.7 2.3 Tolerance 0.05 0.3 0.1 0.1 0.1 0.1
P0 D P2 E F W t
K0
B0 Polarity
P A0
D1
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3. Reel dimensions
Unit: mm 9 0.3 11.4 1.0 +0 180 -4
2 0.5
4. Leader and trailer sections of tape
40 mm or more (Note 1)
40 mm or more (Note 2) Leading part: 190 mm (min)
Note1: Empty trailer section Note2: Empty leader section
13
60
44
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5. Packing form
(1) Packing quantity
Reel Carton 2,000 pcs 10,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Label contents Shipped products are mentioned the following contents. P/N:
TYPE ADDC 1) xxxxxx 3) (xxxxx) 7) Use
TOSHIBA
TLWK1100B
(T11) 2) xxxxxxxx Q'TY 4) xxx 2,000 pcs 5)xxxx
6) E6SAG-0W0S6-07
under 5-30degC/60%RH within 168h
[[G]]/RoHS COMPATIBLE *Y3804xxxxxxxxxxxxxxxxx*
SEAL DATE: xxxxxxxx DIFFUSED IN JAPAN ASSEMBLED IN JAPAN
Contents about Note section (Each example means the contents are different for each lot.)
Information for customers use 1) Lot code Example: 2707C2B 2) Key code Example: 12345678 3) Rank symbol Example: B5WA1 Information for Toshiba use 4) Management code Example: 715 32G 5) Packing quantity Example: 2000 pcs 6) Product information E6SAG-0W0S6-07 7) Storage condition after opening Use under 5-30 degC/60%RH within 168h
(2) Label location
* Reel * Carton
Tape feel direction
Label position Label position * The aluminum package in which the reel is supplied also has the label attached to center of one side.
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN GENERAL
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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